Two-Dimensionally Ordered Copper Grid Patterns Prepared via Electroless Deposition Using a Colloidal-Crystal Film as the Template

Authors


  • The authors are grateful to the NSFC for financial support of this work. (Grant No: 20274002.)

Abstract

Two-dimensionally ordered copper grid patterns with different pore sizes and thickness have been fabricated via electroless copper deposition using a colloidal-crystal film as the template. The pore size of the grid can be adjusted by altering the deposition time. The copper films, with thicknesses of ≈ 100–130 nm and pore sizes of ≈ 100 nm, are flexible and can be peeled off a silicon wafer and rolled up into a reel. Three-dimensionally ordered porous copper materials have also been prepared using a similar method.

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