The author gratefully acknowledges the generous support for our work by the U.S. Department of Energy through the Frederick Seitz Materials Research Laboratory (Grant# DEFG02-91ER45439), the Army Research Office through the MURI program under Award# DAAD19-03-1-0227, and the Air Force Office of Scientific Research under Award No. FA9550–05-1-0092 (Subaward No. E-18-C45-G1). This work has benefited greatly from the valuable contributions of J. Cesarano, J. Smay, G. Gratson, M. Xu, R. Shepherd, R. Rao, S. White, D. Therriault, F. Garcia, and P. Braun.
Direct Ink Writing of 3D Functional Materials†
Article first published online: 27 OCT 2006
Copyright © 2006 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
Advanced Functional Materials
Volume 16, Issue 17, pages 2193–2204, November, 2006
How to Cite
Lewis, J. A. (2006), Direct Ink Writing of 3D Functional Materials. Adv. Funct. Mater., 16: 2193–2204. doi: 10.1002/adfm.200600434
- Issue published online: 27 OCT 2006
- Article first published online: 27 OCT 2006
- Manuscript Received: 18 MAY 2006
- U.S. Department of Energy through the Frederick Seitz Materials Research Laboratory. Grant Number: DEFG02-91ER45439
- Army Research Office through the MURI program. Grant Number: DAAD19-03-1-0227
- Air Force Office of Scientific Research. Grant Number: FA9550–05-1-0092 (Subaward No. E-18-C45-G1)
- Photonic crystals;
The ability to pattern materials in three dimensions is critical for several technological applications, including composites, microfluidics, photonics, and tissue engineering. Direct-write assembly allows one to design and rapidly fabricate materials in complex 3D shapes without the need for expensive tooling, dies, or lithographic masks. Here, recent advances in direct ink writing are reviewed with an emphasis on the push towards finer feature sizes. Opportunities and challenges associated with direct ink writing are also highlighted.