This paper is dedicated to Prof. Wolfgang A. Herrmann on the occasion of his 60th birthday.
Article first published online: 21 OCT 2008
Copyright © 2008 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
Advanced Functional Materials
Volume 18, Issue 21, pages 3427–3433, November 10, 2008
How to Cite
Zhu, Y., Müller, T. E. and Lercher, J. A. (2008), Single Step Preparation of Novel Hydrophobic Composite Films for Low-k Applications. Adv. Funct. Mater., 18: 3427–3433. doi: 10.1002/adfm.200701394
The financial support of DFG within Forschergruppe 395 “Ausgewählte Materialien und Bauelemente für die Siliziumhöchstintegration” is gratefully acknowledged. We especially appreciate the assistance of Dr. Robert Maurer and Dr. Fabian Katschinski, Wacker Chemie AG. Supporting Information is available online from Wiley InterScience or from the author.
- Issue published online: 3 NOV 2008
- Article first published online: 21 OCT 2008
- Manuscript Revised: 16 JUN 2008
- Manuscript Received: 29 NOV 2007
- composite Materials;
- hybrid Materials;
- porous materials;
Composite films with low dielectric constants (k) containing micro- and mesopores are synthesized from precursor solutions for the preparation of mesoporous silica and ethanolic suspensions of silicalite-1 nanoparticles. The material contains silicalite-1 nanoparticles (include nanocrystals and nanoslabs/intermediates) embedded in a randomly oriented matrix of highly porous mesoporous silica. Micropores result from the incorporated silicalite-1 nanoparticles, while decomposition of the porogen F127 leads to additional mesopores. The porosity of the composite films increases from 9 to 60% with the increase in porogen loading, while in parallel the elastic modulus and hardness decrease. The elastic moduli of the films are in the range of 13–20 GPa. Hydrophobic surfaces of the composite films are obtained by introducing methyl triethoxysilane during the preparation of both precursor solutions, leading to the incorporation of CH3 groups in the final composite films. These methyl groups are stable up to at least 500 °C. A low k value of approximately 2 is observed for films cured at 400 °C in N2 flow, which is ideal for removing templates without decomposing methyl groups. Due to the intrinsic hydrophobicity of the material, post-silylation is not required rendering the composite films attractive candidates for future low k materials.