We thank T. Banks, K. Colravy, and S. J. Robinson for help with processing. The materials parts of this effort were supported by the U.S. Department of Energy (DoE), Division of Materials Sciences under award no. DE-FG02-07ER46471, through the Materials Research Laboratory (MRL). The general characterization facilities were provided through the MRL with support from the University of Illinois and from DoE grants DE-FG02-07ER46453 and DE-FG02-07ER46471. The mechanics theory and the transfer printing systems were developed under support by the Center for Nanoscale Chemical Electrical Mechanical Manufacturing Systems at the University of Illinois (funded by the NSF under grant DMI-0328162). S.-I. Park would like to thank Samsung SDI for the doctoral fellowship support.
Theoretical and Experimental Studies of Bending of Inorganic Electronic Materials on Plastic Substrates†
Article first published online: 1 SEP 2008
Copyright © 2008 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
Advanced Functional Materials
Volume 18, Issue 18, pages 2673–2684, September 23, 2008
How to Cite
Park, S.-I., Ahn, J.-H., Feng, X., Wang, S., Huang, Y. and Rogers, J. A. (2008), Theoretical and Experimental Studies of Bending of Inorganic Electronic Materials on Plastic Substrates. Adv. Funct. Mater., 18: 2673–2684. doi: 10.1002/adfm.200800306
- Issue published online: 16 SEP 2008
- Article first published online: 1 SEP 2008
- Manuscript Revised: 30 APR 2008
- Manuscript Received: 2 MAR 2008
- DoE. Grant Numbers: DE-FG02-07ER46453, DE-FG02-07ER46471
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