Financial support to R.P.I. from the New York State Office of Science, Technology and Academic Research (NYSTAR TTIP grant) is gratefully acknowledged. We also thank Dr. Pei-I. Wang (Department of Physics, RPI) for help with the dielectric and BTS measurements and to Starfire Systems, Inc. (http://www.starfiresystems.com) for donation of the hyperbranched alkoxycarbosilanes. Supporting Information is available online from Wiley InterScience or from the author.
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Full Paper
Ultra Low-k Films Derived from Hyperbranched Polycarbosilanes (HBPCS)†
Article first published online: 18 NOV 2008
DOI: 10.1002/adfm.200801197
Copyright © 2008 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
Additional Information
How to Cite
Rathore, J. S., Interrante, L. V. and Dubois, G. (2008), Ultra Low-k Films Derived from Hyperbranched Polycarbosilanes (HBPCS). Advanced Functional Materials, 18: 4022–4028. doi: 10.1002/adfm.200801197
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Publication History
- Issue published online: 15 DEC 2008
- Article first published online: 18 NOV 2008
- Manuscript Received: 14 AUG 2008
Funded by
- New York State Office of Science, Technology and Academic Research (NYSTAR TTIP grant)
Keywords:
- dielectrics;
- polycarbosilane;
- sol–gel processes;
- thin films
Graphical Abstract
Carbosiloxane porous thin films are prepared from methylene-bridged polycarbosilane and triblock copolymer porogen using the sol–gel process. The elastic modulus values measured for these materials substantially exceed those of traditional porous organosilicates of identical dielectric constant. These results confirm that silicates containing carbon bridging groups belong to a different class of materials when considering the mechanical properties of porous low-k dielectrics.
Abstract
Dense and porous hyperbranched carbosiloxane thin films (HBCSO) are obtained by sol–gel processing using methylene-bridged hyperbranched polycarbosilanes (HBPCSs) with the general compositional formula {(OMe)2Si(CH2)}. Introduction of porosity is achieved using a porogen templating approach, allowing the control of the films' dielectric constant from 2.9 to as low as 1.8. Over the entire dielectric range, the HBCSO films exhibit exceptional mechanical properties, 2–3 times superior to those obtained for non-alkylene bridged organosiloxanes such as methylsilsesquioxanes (MSSQs) of similar densities and k-values.