S. Gajjeraman and G. He contributed equally to this work. This work was supported by NIH grant DE 16533. Supporting Information is available online from Wiley InterScience.
Biological Assemblies Provide Novel Templates for the Synthesis of Biocomposites and Facilitate Cell Adhesion†
Article first published online: 18 NOV 2008
Copyright © 2008 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
Advanced Functional Materials
Volume 18, Issue 24, pages 3972–3980, December 22, 2008
How to Cite
Gajjeraman, S., He, G., Narayanan, K. and George, A. (2008), Biological Assemblies Provide Novel Templates for the Synthesis of Biocomposites and Facilitate Cell Adhesion. Adv. Funct. Mater., 18: 3972–3980. doi: 10.1002/adfm.200801215
- Issue published online: 15 DEC 2008
- Article first published online: 18 NOV 2008
- Manuscript Revised: 28 JUL 2008
- Manuscript Received: 18 FEB 2008
- NIH. Grant Number: DE 16533
- cell adhesion;
Mechanical mismatch and the lack of interactions between implants and the natural tissue environment are major drawbacks in bone tissue engineering. Biomaterials mimicking the self-assembly process and the composition of the bone matrix should provide new routes for fabricating biomaterials possessing novel osteoconductive and osteoinductive properties for bone repair. In the present study, bioinspired strategies are employed to design de novo self-assembled chimeric protein hydrogels comprising leucine zipper motifs flanking a dentin matrix protein 1 domain, which is characterized as a mineralization nucleator. Results show that this chimeric protein could function as a hydroxyapatite nucleator in pseudo-physiological buffer with the formation of highly oriented apatites similar to biogenic bone mineral. It could also function as an inductive substrate for osteoblast adhesion, promote cell surface integrin presentation and clustering, and modulate the formation of focal contacts. Such biomimetic “bottom-up” construction with dual osteoconductive and osteoinductive properties should open new avenues for bone tissue engineering.