Full Paper
Accelerated Self-Healing Via Ternary Interpenetrating Microvascular Networks
Article first published online: 14 SEP 2011
DOI: 10.1002/adfm.201101553
Copyright © 2011 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
Additional Information
How to Cite
Hansen, C. J., White, S. R., Sottos, N. R. and Lewis, J. A. (2011), Accelerated Self-Healing Via Ternary Interpenetrating Microvascular Networks. Adv. Funct. Mater., 21: 4320–4326. doi: 10.1002/adfm.201101553
Publication History
- Issue published online: 16 NOV 2011
- Article first published online: 14 SEP 2011
- Manuscript Received: 9 JUL 2011
Keywords:
- direct-write assembly;
- microvascular networks;
- self-healing
Abstract
Self-healing materials with dual interpenetrating microvascular networks enable two-part healing chemistries and repeated healing of damage in a localized region.1 However, due to slow healing kinetics, multiple days are required between damage events to recover mechanical performance under ambient conditions. By directly writing a third interdigitated microvascular network within these epoxy coating/substrate architectures to enable in situ thermal regulation, the characteristic healing time is reduced by an order of magnitude. Specifically, this third network provides a conduit for circulating a temperature-controlled fluid that rapidly heats the locally damaged region leading to a sharp reduction in the time required for mechanical property restoration.

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