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Highly Conductive, Flexible, Polyurethane-Based Adhesives for Flexible and Printed Electronics

  1. Zhuo Li1,
  2. Rongwei Zhang1,
  3. Kyoung-Sik Moon1,
  4. Yan Liu1,
  5. Kristen Hansen1,
  6. Taoran Le2,
  7. C. P. Wong1,3,*

Article first published online: 19 OCT 2012

DOI: 10.1002/adfm.201202249

Issue

Advanced Functional Materials

Advanced Functional Materials

Volume 23, Issue 11, pages 1459–1465, March 20, 2013

Additional Information

How to Cite

Li, Z., Zhang, R., Moon, K.-S., Liu, Y., Hansen, K., Le, T. and Wong, C. P. (2013), Highly Conductive, Flexible, Polyurethane-Based Adhesives for Flexible and Printed Electronics. Adv. Funct. Mater., 23: 1459–1465. doi: 10.1002/adfm.201202249

Author Information

  1. 1

    School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive, Atlanta, GA, 30332, USA

  2. 2

    School of Electrical and Computer Engineering, Georgia Institute of Technology, 85 5th Street NW, Atlanta, GA, 30308, USA

  3. 3

    Department of Electronic Engineering, The Chinese University of Hong Kong, Shatin NT, Hong Kong SAR, P.R.China

*School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive, Atlanta, GA, 30332, USA.

Publication History

  1. Issue published online: 13 MAR 2013
  2. Article first published online: 19 OCT 2012
  3. Manuscript Revised: 12 SEP 2012
  4. Manuscript Received: 9 AUG 2012

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Keywords:

  • electrically conductive adhesives;
  • flexible electronics;
  • polyurethane;
  • high-conductivity materials

Abstract

Flexible interconnects are one of the key elements in realizing next-generation flexible electronics. While wire bonding interconnection materials are being deployed and discussed widely, adhesives to support flip-chip and surface-mount interconnections are less commonly used and reported. A polyurethane (PU)-based electrically conductive adhesive (ECA) is developed to meet all the requirements of flexible interconnects, including an ultralow bulk resistivity of ≈1.0 × 10−5 Ω cm that is maintained during bending, rolling, and compressing, good adhesion to various flexible substrates, and facile processing. The PU-ECA enables various interconnection techniques in flexible and printed electronics: it can serve as a die-attach material for flip-chip, as vertical interconnect access (VIA)-filling and polymer bump materials for 3D integration, and as a conductive paste for wearable radio-frequency devices.

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