Get access
Advertisement

Highly Conductive, Flexible, Polyurethane-Based Adhesives for Flexible and Printed Electronics

Authors

  • Zhuo Li,

    1. School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive, Atlanta, GA, 30332, USA
    Search for more papers by this author
  • Rongwei Zhang,

    1. School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive, Atlanta, GA, 30332, USA
    Search for more papers by this author
  • Kyoung-Sik Moon,

    1. School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive, Atlanta, GA, 30332, USA
    Search for more papers by this author
  • Yan Liu,

    1. School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive, Atlanta, GA, 30332, USA
    Search for more papers by this author
  • Kristen Hansen,

    1. School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive, Atlanta, GA, 30332, USA
    Search for more papers by this author
  • Taoran Le,

    1. School of Electrical and Computer Engineering, Georgia Institute of Technology, 85 5th Street NW, Atlanta, GA, 30308, USA
    Search for more papers by this author
  • C. P. Wong

    Corresponding author
    1. School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive, Atlanta, GA, 30332, USA
    2. Department of Electronic Engineering, The Chinese University of Hong Kong, Shatin NT, Hong Kong SAR, P.R.China
    • School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive, Atlanta, GA, 30332, USA.
    Search for more papers by this author

Abstract

Flexible interconnects are one of the key elements in realizing next-generation flexible electronics. While wire bonding interconnection materials are being deployed and discussed widely, adhesives to support flip-chip and surface-mount interconnections are less commonly used and reported. A polyurethane (PU)-based electrically conductive adhesive (ECA) is developed to meet all the requirements of flexible interconnects, including an ultralow bulk resistivity of ≈1.0 × 10−5 Ω cm that is maintained during bending, rolling, and compressing, good adhesion to various flexible substrates, and facile processing. The PU-ECA enables various interconnection techniques in flexible and printed electronics: it can serve as a die-attach material for flip-chip, as vertical interconnect access (VIA)-filling and polymer bump materials for 3D integration, and as a conductive paste for wearable radio-frequency devices.

Get access to the full text of this article

Ancillary