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Surface Patterning: Printing of Highly Integrated Crossbar Junctions (Adv. Funct. Mater. 6/2012)

Authors

  • Nils Sanetra,

    1. Peter-Grünberg-Institut, Forschungszentrum Jülich GmbH, D-52428 Jülich, Germany, JARA-Fundamentals of Future Information Technology
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  • Zoi Karipidou,

    1. Sony Deutschland GmbH, Materials Science Laboratory, Stuttgart Technology Center, Hedelfingerstrasse 61, D-70327 Stuttgart, Germany
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  • René Wirtz,

    1. Sony Deutschland GmbH, Materials Science Laboratory, Stuttgart Technology Center, Hedelfingerstrasse 61, D-70327 Stuttgart, Germany
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  • Nikolaus Knorr,

    1. Sony Deutschland GmbH, Materials Science Laboratory, Stuttgart Technology Center, Hedelfingerstrasse 61, D-70327 Stuttgart, Germany
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  • Silvia Rosselli,

    1. Sony Deutschland GmbH, Materials Science Laboratory, Stuttgart Technology Center, Hedelfingerstrasse 61, D-70327 Stuttgart, Germany
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  • Gabriele Nelles,

    1. Sony Deutschland GmbH, Materials Science Laboratory, Stuttgart Technology Center, Hedelfingerstrasse 61, D-70327 Stuttgart, Germany
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  • Andreas Offenhaeusser,

    1. Peter-Grünberg-Institut, Forschungszentrum Jülich GmbH, D-52428 Jülich, Germany, JARA-Fundamentals of Future Information Technology
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  • Dirk Mayer

    Corresponding author
    1. Peter-Grünberg-Institut, Forschungszentrum Jülich GmbH, D-52428 Jülich, Germany, JARA-Fundamentals of Future Information Technology
    • Peter-Grünberg-Institut, Forschungszentrum Jülich GmbH, D-52428 Jülich, Germany, JARA-Fundamentals of Future Information Technology.
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Abstract

original image

On page 1129, Dirk Mayer and co-workers report the non-invasive assembly of highly integrated metal-bridge-metal crossbar junctions under ambient conditions by combining nanoimprint lithography and soft lithography. Different views of the printing process and ready assembled crossbar arrays are shown. Conductive polymer films are incorporated in the cross points to evaluate the utility and versatility of the soft lithography approach.

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