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Materials and Fabrication Processes for Transient and Bioresorbable High-Performance Electronics

Authors

  • Suk-Won Hwang,

    1. Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801 USA
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  • Dae-Hyeong Kim,

    1. Center for Nanoparticle Research of Institute for Basic Science, School of Chemical and Biological Engineering, Seoul National University, Seoul 151- 741, Republic of Korea
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  • Hu Tao,

    1. Department of Biomedical Engineering, Tufts University, Medford, MA 02155, USA
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  • Tae-il Kim,

    1. Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801 USA
    2. School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon 440-746, Republic of Korea
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  • Stanley Kim,

    1. Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801 USA
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  • Ki Jun Yu,

    1. Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
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  • Bruce Panilaitis,

    1. Department of Biomedical Engineering, Tufts University, Medford, MA 02155, USA
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  • Jae-Woong Jeong,

    1. Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801 USA
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  • Jun-Kyul Song,

    1. Department of Chemistry, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
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  • Fiorenzo G. Omenetto,

    1. Department of Biomedical Engineering, Tufts University, Medford, MA 02155, USA
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  • John. A. Rogers

    Corresponding author
    1. Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801 USA
    2. Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
    3. Department of Chemistry, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
    4. Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
    • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801 USA.
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Abstract

Materials and fabrication procedures are described for bioresorbable transistors and simple integrated circuits, in which the key processing steps occur on silicon wafer substrates, in schemes compatible with methods used in conventional microelectronics. The approach relies on an unusual type of silicon on insulator wafer to yield devices that exploit ultrathin sheets of monocrystalline silicon for the semiconductor, thin films of magnesium for the electrodes and interconnects, silicon dioxide and magnesium oxide for the dielectrics, and silk for the substrates. A range of component examples with detailed measurements of their electrical characteristics and dissolution properties illustrate the capabilities. In vivo toxicity tests demonstrate biocompatibility in sub-dermal implants. The results have significance for broad classes of water-soluble, “transient” electronic devices.

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