Dissolution Behaviors and Applications of Silicon Oxides and Nitrides in Transient Electronics

Authors

  • Seung-Kyun Kang,

    1. Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
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  • Suk-Won Hwang,

    1. Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
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  • Huanyu Cheng,

    1. Department of Mechanical Engineering, Civil and Environmental Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston, IL, USA
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  • Sooyoun Yu,

    1. Department of Chemical and Biomolecular Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA
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  • Bong Hoon Kim,

    1. Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
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  • Jae-Hwan Kim,

    1. Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
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  • Yonggang Huang,

    1. Department of Mechanical Engineering, Civil and Environmental Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston, IL, USA
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  • John A. Rogers

    Corresponding author
    1. Department of Materials Science and Engineering Chemistry, Mechanical Science and Engineering, Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
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Abstract

Silicon oxides and nitrides are key materials for dielectrics and encapsulation layers in a class of silicon-based high performance electronics that has ability to completely dissolve in a controlled fashion with programmable rates, when submerged in bio-fluids and/or relevant solutions. This type of technology, referred to as “transient electronics”, has potential applications in biomedical implants, environmental sensors, and other envisioned areas. The results presented here provide comprehensive studies of transient behaviors of thin films of silicon oxides and nitrides in diverse aqueous solutions at different pH scales and temperatures. The kinetics of hydrolysis of these materials depends not only on pH levels/ion concentrations of solutions and temperatures, but also on the morphology and chemistry of the films, as determined by the deposition methods and conditions. Encapsulation strategies with a combination of layers demonstrate enhancement of the lifetime of transient electronic devices, by reducing water/vapor permeation through the defects.

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