Novel Heterogeneous Integration Technology of III–V Layers and InGaAs FinFETs to Silicon
Version of Record online: 7 APR 2014
© 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
Advanced Functional Materials
Volume 24, Issue 28, pages 4420–4426, July 23, 2014
How to Cite
Dai, X., Nguyen, B.-M., Hwang, Y., Soci, C. and Dayeh, S. A. (2014), Novel Heterogeneous Integration Technology of III–V Layers and InGaAs FinFETs to Silicon. Adv. Funct. Mater., 24: 4420–4426. doi: 10.1002/adfm.201400105
- Issue online: 19 JUL 2014
- Version of Record online: 7 APR 2014
- Manuscript Revised: 4 MAR 2014
- Manuscript Received: 12 JAN 2014
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