Transient Electronics: Dissolvable Metals for Transient Electronics (Adv. Funct. Mater. 5/2014)

Authors

  • Lan Yin,

    1. Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
    Search for more papers by this author
  • Huanyu Cheng,

    1. Department of Mechanical Engineering and Department of Civil and Environmental Engineering, Northwestern University, Center for Engineering and Health and Skin Disease Research Center, Evanston, Illinois, USA
    Search for more papers by this author
  • Shimin Mao,

    1. Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
    Search for more papers by this author
  • Richard Haasch,

    1. Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
    Search for more papers by this author
  • Yuhao Liu,

    1. Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
    Search for more papers by this author
  • Xu Xie,

    1. Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
    Search for more papers by this author
  • Suk-Won Hwang,

    1. Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
    Search for more papers by this author
  • Harshvardhan Jain,

    1. Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA
    Search for more papers by this author
  • Seung-Kyun Kang,

    1. Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
    Search for more papers by this author
  • Yewang Su,

    1. Department of Mechanical Engineering and Department of Civil and Environmental Engineering, Northwestern University, Center for Engineering and Health and Skin Disease Research Center, Evanston, Illinois, USA
    Search for more papers by this author
  • Rui Li,

    1. State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, China
    Search for more papers by this author
  • Yonggang Huang,

    1. Department of Mechanical Engineering and Department of Civil and Environmental Engineering, Northwestern University, Center for Engineering and Health and Skin Disease Research Center, Evanston, Illinois, USA
    Search for more papers by this author
  • John A. Rogers

    Corresponding author
    1. Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
    • Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana IL 61801 USA

    Search for more papers by this author

Abstract

image

Electronics technologies that can physically disappear by dissolution in water or biofluids have broad applications in implantable, environmentally friendly, and hardware-secure devices. On page 645, J. A. Rogers and co-workers study the materials science of various metal thin films that can serve as dissolvable conductors in transient electronics. This image shows dissolving thin films of zinc as contacts for silicon transistors along with measurements of changes in electronic performance during this time.

Ancillary