Semiconductor wafer bonding

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Abstract

High-voltage pn-diodes, and silicon on insulator (SOI) materials are two applications that could benefit from a new method of wafer bonding which can be carried out in a normal laboratory environment. The procedure, which involves spinning the wafers at high speed (see figure) thus creating a “micro-cleanroom” between them, could also have applications in micro-mechanical work and wafer protection.

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