Electrical contactswith low resistance for melt-processed high-Tc Superconductors

Authors

  • Dr. Steffen Elschner,

    Corresponding author
    1. Hoechst AG, Zentralforschung II, W-6230 Frankfurt am Main 80 (FRG)
    • Hoechst AG, Zentralforschung II, W-6230 Frankfurt am Main 80 (FRG)
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  • Dr. Joachim Bock

    Corresponding author
    1. Hoechst AG, Werk Knapsack, W-5030 Hürth (FRG)
    • Hoechst AG, Zentralforschung II, W-6230 Frankfurt am Main 80 (FRG)
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  • We thank G. Brommer, W. Horst, and R. Reichling for technical assistance and W. Becker, P. Haussler and E., Preisler for valuable discussions [AMSC117].

Abstract

Low electrical resistance and high thermal and mechanical stability are required of the materials used to connect ssuperconducting materials with normal conducting leads. The sputter deposition of silver or gold layers into melt-processed BSCCO superconducting material results in contacts in the mω range which is too high for high-current applications. An alternative method is presented which takes advantage of the BSCCO production method and requires no additional processing steps.

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