Silicon wafer bonding via designed monolayers**


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    We would like to thank Mrs. Hopfe for careful TEM specimen preparation.


Silicon wafer bonding is a technology which allows two silicon wafers to stick together without any glue (e.g. see Fig.). The technique is used in the areas of microelectronics, micromechanics, and power electronics. Hydrolyzed tetramethoxysilane is used in he new bonding process presented here, providing a low-temperature method of wafer bonding compatible with the presence of microelectronics aluminum metallization

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