We would like to thank Mrs. Hopfe for careful TEM specimen preparation.
Silicon wafer bonding via designed monolayers**
Version of Record online: 15 SEP 2004
Copyright © 1995 Verlag GmbH & Co. KGaA, Weinheim
Volume 7, Issue 7, pages 662–665, July 1995
How to Cite
Gösele, U., Steinnkirchner, J., Martini, T., Reiche, M. and Kästner, G. (1995), Silicon wafer bonding via designed monolayers. Adv. Mater., 7: 662–665. doi: 10.1002/adma.19950070714
- Issue online: 15 SEP 2004
- Version of Record online: 15 SEP 2004
- Manuscript Revised: 22 MAR 1995
- Manuscript Received: 16 FEB 1995
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