This research was supported in part by the Deutsche Forschungsgemeinschaft. We gratefully acknowledge Gabriele Herrmann and Ulrike Faces for their helpful assistance.
Room temperature silicon wafer bonding with ultra-thin polymer films†
Article first published online: 29 OCT 2004
Copyright © 1997 Verlag GmbH & Co. KGaA, Weinheim
Volume 9, Issue 5, pages 417–420, Mai 1997
How to Cite
Kräuter, G., Schumacher, A., Gösele, U., Jaworek, T. and Wegner, G. (1997), Room temperature silicon wafer bonding with ultra-thin polymer films. Adv. Mater., 9: 417–420. doi: 10.1002/adma.19970090512
- Issue published online: 29 OCT 2004
- Article first published online: 29 OCT 2004
- Manuscript Revised: 9 JAN 1997
- Manuscript Received: 14 NOV 1996
Bonding of silicon wafers is required in microelectronics fabrication, for example. A room-temperature bonding process that leads to sufficient bond strength is necessary for bonding semi-processed wafers, i.e., those already containing temperature-sensitive structures. The room-temperature bonding of hydrophobic wafers is reported for the first time, an ultra-tin Langmuir-Blodgett film of a “hairy” rod-like polymer being used as an intermediate layer. The effect of the polymer layer on the surface roughness is investigated and possible directions o future work are indicated.