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Bonding of silicon wafers is required in microelectronics fabrication, for example. A room-temperature bonding process that leads to sufficient bond strength is necessary for bonding semi-processed wafers, i.e., those already containing temperature-sensitive structures. The room-temperature bonding of hydrophobic wafers is reported for the first time, an ultra-tin Langmuir-Blodgett film of a “hairy” rod-like polymer being used as an intermediate layer. The effect of the polymer layer on the surface roughness is investigated and possible directions o future work are indicated.