Ultrananocrystalline diamond (UNCD) may offer a solution to tribological failure of silicon-based micromachines because of its outstanding mechanical properties. The first measurements of nanometer-scale adhesion and friction on the tribologically relevant underside of UNCD films (see Figure) are reported, revealing that the UNCD films are far less adhesive than silicon and confirming their potential for use in micro- and nanomachines.
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