The authors acknowledge financial support from the U. S. Department of Energy under contract DE-AC06-76RL through Pacific Northwest National Laboratory operated by Battelle Memorial Institute.
High-Dielectric-Constant Silver–Epoxy Composites as Embedded Dielectrics†
Article first published online: 8 JUL 2005
Copyright © 2005 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
Volume 17, Issue 14, pages 1777–1781, July, 2005
How to Cite
Qi, L., Lee, B. I., Chen, S., Samuels, W. D. and Exarhos, G. J. (2005), High-Dielectric-Constant Silver–Epoxy Composites as Embedded Dielectrics. Adv. Mater., 17: 1777–1781. doi: 10.1002/adma.200401816
- Issue published online: 8 JUL 2005
- Article first published online: 8 JUL 2005
- Manuscript Accepted: 6 APR 2005
- Manuscript Received: 4 NOV 2004
- Epoxy-based materials;
- Flexible electronics;
- Nanoparticles, metal
The incorporation of organic-coated silver nanoparticles into an epoxy matrix (see Figure, a–f represent increasing Ag content) results in a flexible 0-3 type nanocomposite with a strikingly high dielectric constant (greater than 300). The composite retains the flexibility and other mechanical properties of the polymer matrix, and may be useful in applications where capacitors are embedded into printed circuit boards.