Communication

Rigiflex Lithography for Nanostructure Transfer

  1. D. Suh1,
  2. S.-J. Choi2,
  3. H. H. Lee1

Article first published online: 7 JUN 2005

DOI: 10.1002/adma.200402010

Issue

Advanced Materials

Advanced Materials

Volume 17, Issue 12, pages 1554–1560, June, 2005

Additional Information

How to Cite

Suh, D., Choi, S.-J. and Lee, H. H. (2005), Rigiflex Lithography for Nanostructure Transfer. Adv. Mater., 17: 1554–1560. doi: 10.1002/adma.200402010

Author Information

  1. 1

    School of Chemical Engineering, Seoul National University, Seoul, 151-744, Korea

  2. 2

    Minuta Tech., Center for Biotechnology Incubating, Seoul, 151-742, Korea

Publication History

  1. Issue published online: 7 JUN 2005
  2. Article first published online: 7 JUN 2005
  3. Manuscript Accepted: 14 MAR 2005
  4. Manuscript Received: 9 DEC 2004

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Keywords:

  • Composite materials;
  • Lithography, nano-;
  • Molding;
  • Soft lithography
Thumbnail image of graphical abstract

Rigiflex lithography combines the mold rigidity of imprint lithography, which permits fine patterning, with the mold flexibility of soft lithography, allowing intimate contact of the mold with the surface substrate over a large area. A UV-curable mold based on poly(urethane acrylate) is prepared as a film on a flexible poly(ethylene terephthalate) support, allowing nanopatterns to be prepared by a bilayer-transfer technique (see Figure).

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