Large-Area, Selective Transfer of Microstructured Silicon: A Printing- Based Approach to High-Performance Thin-Film Transistors Supported on Flexible Substrates

Authors

  • K. J. Lee,

    1. Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, 104 S. Goodwin Avenue, Urbana, IL 61801, USA
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  • M. J. Motala,

    1. Department of Chemistry, University of Illinois at Urbana-Champaign, 104 S. Goodwin Avenue, Urbana, IL 61801, USA
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  • M. A. Meitl,

    1. Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, 104 S. Goodwin Avenue, Urbana, IL 61801, USA
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  • W. R. Childs,

    1. Department of Chemistry, University of Illinois at Urbana-Champaign, 104 S. Goodwin Avenue, Urbana, IL 61801, USA
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  • E. Menard,

    1. Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, 104 S. Goodwin Avenue, Urbana, IL 61801, USA
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  • A. K. Shim,

    1. Dow Corning Corporation, Midland, MI 48686, USA
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  • J. A. Rogers,

    1. Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, 104 S. Goodwin Avenue, Urbana, IL 61801, USA
    2. Department of Chemistry and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, 104 S. Goodwin Avenue, Urbana, IL 61801, USA
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  • R. G. Nuzzo

    1. Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, 104 S. Goodwin Avenue, Urbana, IL 61801, USA
    2. Department of Chemistry and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, 104 S. Goodwin Avenue, Urbana, IL 61801, USA
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  • This work was supported by the DARPA-funded and AFRL-managed Macroelectronics Program, and in part by the National Science Foundation (DMI-0355532 and CHE-0402420) using the facilities at the Frederick Seitz Materials Research Laboratory, supported by the Department of Energy (DEFG02-96ER45439). M. A. M. thanks the Fannie and John Hertz Foundation for their support via a graduate fellowship.

Abstract

original image

The selective transfer and accurate registration of microstructured silicon (μs-Si) across large areas is demonstrated using a printing-based procedure applicable to both rigid (i.e., glass) and flexible plastic substrates (see Figure). The utility of this technique to construct macroelectronic systems that incorporate high-performance μs-Si thin-film transistors on flexible substrates is also demonstrated.

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