Direct-Write Assembly of Three-Dimensional Photonic Crystals: Conversion of Polymer Scaffolds to Silicon Hollow-Woodpile Structures

Authors

  • G. M. Gratson,

    1. Beckman Institute for Advanced Science and Technology, Department of Materials Science and Engineering, and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
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  • F. García-Santamaría,

    1. Beckman Institute for Advanced Science and Technology, Department of Materials Science and Engineering, and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
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  • V. Lousse,

    1. Department of Chemical and Biomolecular Engineering, Department of Materials Science and Engineering, and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
    2. Laboratoire de Physique du Solide, Facultes Universitaires Notre-Dame de la Paix, B-5000 Namur, Belgium
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  • M. Xu,

    1. Department of Chemical and Biomolecular Engineering, Department of Materials Science and Engineering, and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
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  • S. Fan,

    1. Department of Electrical Engineering, Stanford University, Stanford, CA 94305-4088, USA
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  • J. A. Lewis,

    1. Beckman Institute for Advanced Science and Technology, Department of Materials Science and Engineering, and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
    2. Department of Chemical and Biomolecular Engineering, Department of Materials Science and Engineering, and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
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  • P. V. Braun

    1. Beckman Institute for Advanced Science and Technology, Department of Materials Science and Engineering, and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
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  • G. M. Gratson and F. García-Santamaría contributed equally to this work. This material is based in part on work supported by the U.S. Department of Energy, Division of Materials Sciences, under Award No. DEFG-02-91ER45439, through the Frederick Seitz Materials Research Laboratory at the University of Illinois at Urbana-Champaign, and the U.S. Army Research Laboratory and the U.S. Army Research Office under contract/grant number DAAD19-03-1-0227, and was carried out in part in the Center for Microanalysis of Materials, University of Illinois, which is partially supported by the U.S. Department of Energy under grant DEFG02-91-ER45439. V. L. was supported in part as Postdoctoral Fellow by the Belgian National Fund for Scientific Research (FNRS).

Abstract

original image

3D Si hollow-woodpile photonic crystals are formed through the direct-write assembly of concentrated polyelectrolyte inks (rods ∼1 μm in diameter) followed by a sequential silica/silicon chemical vapor deposition process (see Figure). The direct conversion of 3D polymer microstructures to materials like silicon may enable such applications as photonic materials, low-cost microelectromechanical systems (MEMS), microfluidic networks for heat dissipation, and biological devices.

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