This project is supported by the DOE IPP program office. Supporting Information is available online from Wiley InterScience or from the author.
Simultaneously Increasing the Ductility and Strength of Ultra-Fine-Grained Pure Copper†
Article first published online: 27 OCT 2006
Copyright © 2006 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
Volume 18, Issue 22, pages 2949–2953, November, 2006
How to Cite
Zhao, Y.-H., Bingert, J. F., Liao, X.-Z., Cui, B.-Z., Han, K., Sergueeva, A. V., Mukherjee, A. K., Valiev, R. Z., Langdon, T. G. and Zhu, Y. T. (2006), Simultaneously Increasing the Ductility and Strength of Ultra-Fine-Grained Pure Copper. Adv. Mater., 18: 2949–2953. doi: 10.1002/adma.200601472
- Issue published online: 14 NOV 2006
- Article first published online: 27 OCT 2006
- Manuscript Revised: 12 AUG 2006
- Manuscript Received: 2 JUL 2006
- DOE IPP program office
- Grain boundaries;
- Mechanical properties;
- Structure–property relationships
Simultaneous increase of the ductility and strength of bulk ultra-fine-grained (UFG) Cu is achieved by introducing large amounts of deformation twins and high-angle grain boundaries via cryodrawing and cryorolling (red plots and image). Bulk UFG materials usually have high strength but disappointingly low ductility. Most previous attempts to enhance the ductility of single-phased UFG materials sacrificed their yield strength. This work provides a new approach for increasing ductility without sacrificing strength.