Stacking of Organic Thin Film Transistors: Vertical Integration

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Abstract

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Three-dimensional integration in the vertical direction is attractive for organic thin film transistors (OTFTs) and circuits based on OTFTs simply because the device fabrication involves forming layers in the vertical direction. For the vertical stacking of the devices, however, any device in the stacked configuration has to be isolated from the ones above and below the device. We developed approaches that can resolve the problems for the vertical stacking of organic thin film transistors.

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