Thermally Stable Organic–Inorganic Hybrid Photoresists for Fabrication of Photonic Band Gap Structures with Direct Laser Writing

Authors

  • Y. Jun,

    1. Department of Chemical Engineering & Materials Science, University of Minnesota, Minneapolis, MN 55455 (USA)
    2. Present address: Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
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  • P. Nagpal,

    1. Department of Chemical Engineering & Materials Science, University of Minnesota, Minneapolis, MN 55455 (USA)
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  • D. J. Norris

    1. Department of Chemical Engineering & Materials Science, University of Minnesota, Minneapolis, MN 55455 (USA)
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  • This work was supported by the US National Science Foundation under Award Number CTS-0332484 and by the US Department of Energy under Award Number DE-FG02-06ER46348. D.J.N. benefited from a fellowship from the Alexander von Humboldt Foundation. The authors thank J. Sedgewick and J. Oja for microscopy assistance.

Abstract

original image

A recently developed methylsilsesquioxane-based photoresist is combined with direct laser writing to define 3D microstructures (see image). Because the resulting structures exhibit thermal stability above 500 °C without cracking or significant distortions, they should allow photonic crystals and other microstructures to be obtained from a large variety of materials. This is demonstrated by infiltrating a “woodpile” photonic crystal with silicon using chemical vapor deposition.

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