Calix[4]resorcinarene Derivatives as High-Resolution Resist Materials for Supercritical CO2 Processing

Authors


  • The authors would like to thank the Semiconductor Research Corporation (SRC) and the SRC/Sematech ERC for Environmentally Benign Semiconductor Manufacturing for financial support. They would also like to thank the Cornell Center for Materials Research (CCMR) and the Cornell NanoScale Facility (CNF) for use of facilities.

Abstract

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Ultra-high-resolution lithography resists based on calix[4] resorcinarene derivatives are shown to be compatible with supercritica l CO2 processing upon the incorporation of specific functionali ties, as illustrated by the inset to the figure. The compounds show high glass-transition temperatures, excellent solubility in supercritical CO2, and good film forming properties, enabling the patterning of line/space features as small as 70 nm (depicted in the figure).

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