Universal Block Copolymer Lithography for Metals, Semiconductors, Ceramics, and Polymers

Authors


  • We thank G. S. Kim and J.-H. Ahn for assistance with thin film depositions, and S. S. Bae for assistance with SEM analysis. This work was supported by the second stage of the Brain Korea 21 Project, the Korea Research Foundation (KRF-2005-003-D00085), the Basic Research Program of the Korea Science & Engineering Foundation (R01-2005- 000-10456-0), the Korean Ministry of Science and Technology, and the Korean Ministry of Science and Technology and Fundamental R&D Program for Core Technology of Materials funded by the Korean Ministry of Commerce, Industry and Energy. Also, this work was partially supported by grants-in-aid for the National Core Research Center Program from MOST/KOSEF (No. R15-2006-022-01001-0).

Abstract

original image

A universal block copolymer lithography is developed for a broad spectrum of materials including metals, semiconductors, ceramics, and polymers by combining advanced film deposition techniques with block copolymer lithography. The figure presents a nanopatterned platinum film prepared by applying universal block copolymer lithography.

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