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Cover Picture: A Germanium Inverse Woodpile Structure with a Large Photonic Band Gap (Adv. Mater. 12/2007)

Authors

  • F. García-Santamaría,

    1. Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, Beckman Institute, University of Illinois at Urbana-Champaign, Urbana, IL 61801 (USA)
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  • M. Xu,

    1. Department of Chemical and Biomolecular Engineering, Urbana, IL 61801 (USA)
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  • V. Lousse,

    1. Department of Electrical Engineering, Stanford University, Stanford, CA 94305-4088 (USA)
    2. Laboratoire de Physique du Solide, Facultes Universitaires Notre-Dame de la Paix, 5000 Namur (Belgium)
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  • S. Fan,

    1. Department of Electrical Engineering, Stanford University, Stanford, CA 94305-4088 (USA)
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  • P. V. Braun,

    1. Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, Beckman Institute, University of Illinois at Urbana-Champaign, Urbana, IL 61801 (USA)
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  • J. A. Lewis

    1. Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, Beckman Institute, University of Illinois at Urbana-Champaign, Urbana, IL 61801 (USA)
    2. Department of Chemical and Biomolecular Engineering, Urbana, IL 61801 (USA)
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Abstract

Germanium inverse woodpile 3D photonic crystals with a large (25%) photonic band gap in the infrared (background image) were fabricated through a multistep replication procedure. A polymer scaffold was first created by direct-write assembly, followed by the conformal growth of oxide and semiconductor layers, and removal of the polymer and oxide (foreground), as reported on p. 1567 by Paul Braun, Jennifer Lewis, and co-workers.

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