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Advanced Materials

Highly Versatile and Robust Materials for Soft Imprint Lithography Based on Thiol-ene Click Chemistry

Authors

  • Luis M. Campos,

    1. Mitsubishi Chemical Center for Advanced Materials Materials Research Laboratory and University of California Santa Barbara, CA 93111 (USA)
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  • Ines Meinel,

    1. MC Research and Innovation Center 601 Pine Avenue, Goleta, CA 93117 (USA)
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  • Rosette G. Guino,

    1. Mitsubishi Chemical Center for Advanced Materials Materials Research Laboratory and University of California Santa Barbara, CA 93111 (USA)
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  • Martin Schierhorn,

    1. Mitsubishi Chemical Center for Advanced Materials Materials Research Laboratory and University of California Santa Barbara, CA 93111 (USA)
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  • Nalini Gupta,

    1. Mitsubishi Chemical Center for Advanced Materials Materials Research Laboratory and University of California Santa Barbara, CA 93111 (USA)
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  • Galen D. Stucky,

    1. Mitsubishi Chemical Center for Advanced Materials Materials Research Laboratory and University of California Santa Barbara, CA 93111 (USA)
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  • Craig J. Hawker

    Corresponding author
    1. Mitsubishi Chemical Center for Advanced Materials Materials Research Laboratory and University of California Santa Barbara, CA 93111 (USA)
    • Mitsubishi Chemical Center for Advanced Materials Materials Research Laboratory and University of California Santa Barbara, CA 93111 (USA).
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  • Financial support from the NSF (CHE-0514031 and the MRSEC Program DMR-0520415 (MRL-UCSB)), Mitsubishi Chemical Center for Advanced Materials (MC-CAM) and Mitsubishi Chemical Group Science and Technology Research Center, Inc. is gratefully acknowledged. We also thank Dr. B. W. Messmore for the synthesis of 4PEGSH. Supporting Information is available online from Wiley InterScience or from the author.

Abstract

As easy as “shake and bake”, the mixing and photocuring of poly-functional thiols with alkene-functional cross-linkers, via thiol-ene click chemistry, leads to materials with outstanding and tunable characteristics for soft imprint lithography. The materials are cured within 2 minutes at ambient conditions allowing stamps with high aspect ratio and sub-100 nm features to be fabricated.

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