Communication

Close-Packed Gold-Nanocrystal Assemblies Deposited with Complete Selectivity into Lithographic Trenches†

  1. S. Ahmed1,2,
  2. Kevin M. Ryan1,2,*

Article first published online: 22 OCT 2008

DOI: 10.1002/adma.200801007

Issue

Advanced Materials

Advanced Materials

Volume 20, Issue 24, pages 4745–4750, December 17, 2008

Additional Information

How to Cite

Ahmed, S. and Ryan, K. M. (2008), Close-Packed Gold-Nanocrystal Assemblies Deposited with Complete Selectivity into Lithographic Trenches. Adv. Mater., 20: 4745–4750. doi: 10.1002/adma.200801007

Author Information

  1. 1

    Materials and Surface Science Institute University of Limerick Limerick (Ireland)

  2. 2

    Department of Chemical and Environmental Sciences University of Limerick Limerick (Ireland)

*Materials and Surface Science Institute University of Limerick Limerick (Ireland).

  1. †

    The work was principally supported by Science Foundation Ireland (SFI) under the Principal Investigator Programme Contract No. 06/IN.1/I85 and the National Access Programme, NAP89. Enterprise Ireland funding under PC/2006/332 for S. A. is also acknowledged. The authors thank Prof. Noel Buckley for access to Hitachi S4800 HRSEM and useful discussions. Access to Rigaku MicroMax-007 SAXS from Prof. Martin Caffrey is further acknowledged. Supporting Information is available online from Wiley InterScience or from the authors.

Publication History

  1. Issue published online: 16 DEC 2008
  2. Article first published online: 22 OCT 2008
  3. Manuscript Revised: 29 JUL 2008
  4. Manuscript Received: 11 APR 2008

Funded by

  • Enterprise Ireland. Grant Number: PC/2006/332

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Keywords:

  • close-packed assembly;
  • electric-field deposition;
  • gold nanocrystals;
  • lithography
Thumbnail image of graphical abstract

Close-packed gold-nanocrystal assemblies are selectively deposited into trenches (300 nm × 300 nm) fabricated by electron-beam lithography. The base of the trenches consists of highly doped silicon with 30 nm silica walls. The assemblies are formed using electric-field mediated deposition of8 nm gold spheres from organic solvents.

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