Communication

Ultrarapid Transient-liquid-phase Bonding of Al2O3Ceramics†

  1. Sung M. Hong,
  2. Christopher C. Bartlow,
  3. Thomas B. Reynolds,
  4. Joseph T. McKeown,
  5. Andreas M. Glaeser*

Article first published online: 15 OCT 2008

DOI: 10.1002/adma.200801550

Issue

Advanced Materials

Advanced Materials

Volume 20, Issue 24, pages 4799–4803, December 17, 2008

Additional Information

How to Cite

Hong, S. M., Bartlow, C. C., Reynolds, T. B., McKeown, J. T. and Glaeser, A. M. (2008), Ultrarapid Transient-liquid-phase Bonding of Al2O3Ceramics. Adv. Mater., 20: 4799–4803. doi: 10.1002/adma.200801550

Author Information

  1. Department of Materials Science & Engineering, University of California 319 Hearst Mining Building, MC1760, Berkeley, CA 94720-1760 (USA)

*Department of Materials Science & Engineering, University of California 319 Hearst Mining Building, MC1760, Berkeley, CA 94720-1760 (USA).

  1. †

    This research was supported by the Materials Processing Manufacturing Program of the Division of Design, Manufacture, and Industrial Innovation of the National Science Foundation, under Contract Nos. DMI-0522652 and DMI-0621193. T. R. acknowledges support in the form on an NDSEG Graduate Fellowship. C. B. acknowledges partial support in the form of a Jane Lewis Fellowship. Supporting Information is available online from Wiley InterScience or from the author.

Publication History

  1. Issue published online: 16 DEC 2008
  2. Article first published online: 15 OCT 2008
  3. Manuscript Received: 6 JUN 2008

SEARCH

SEARCH BY CITATION

ARTICLE TOOLS

Get PDF (307K)

Keywords:

  • alloys;
  • assembly;
  • ceramics;
  • composites;
  • thin films
Thumbnail image of graphical abstract

An effective multilayer interlayer technology for rapid transient-liquid-phase joining of advanced ceramics is demonstrated. Interlayers designed to exhibit rapid interdiffusion, chemical homogenization, and liquid film disappearance, enable rapid and reliable joining of ceramics at reduced temperatures while preserving high-temperature use capability. Processing times as short as 5 min at 1400 °C yield interlayers with a remelt temperature >2200 °C.

Get PDF (307K)