Ultrarapid Transient-liquid-phase Bonding of Al2O3Ceramics

Authors

  • Sung M. Hong,

    1. Department of Materials Science & Engineering, University of California 319 Hearst Mining Building, MC1760, Berkeley, CA 94720-1760 (USA)
    Search for more papers by this author
  • Christopher C. Bartlow,

    1. Department of Materials Science & Engineering, University of California 319 Hearst Mining Building, MC1760, Berkeley, CA 94720-1760 (USA)
    Search for more papers by this author
  • Thomas B. Reynolds,

    1. Department of Materials Science & Engineering, University of California 319 Hearst Mining Building, MC1760, Berkeley, CA 94720-1760 (USA)
    Search for more papers by this author
  • Joseph T. McKeown,

    1. Department of Materials Science & Engineering, University of California 319 Hearst Mining Building, MC1760, Berkeley, CA 94720-1760 (USA)
    Search for more papers by this author
  • Andreas M. Glaeser

    Corresponding author
    1. Department of Materials Science & Engineering, University of California 319 Hearst Mining Building, MC1760, Berkeley, CA 94720-1760 (USA)
    • Department of Materials Science & Engineering, University of California 319 Hearst Mining Building, MC1760, Berkeley, CA 94720-1760 (USA).
    Search for more papers by this author

  • This research was supported by the Materials Processing Manufacturing Program of the Division of Design, Manufacture, and Industrial Innovation of the National Science Foundation, under Contract Nos. DMI-0522652 and DMI-0621193. T. R. acknowledges support in the form on an NDSEG Graduate Fellowship. C. B. acknowledges partial support in the form of a Jane Lewis Fellowship. Supporting Information is available online from Wiley InterScience or from the author.

Abstract

original image

An effective multilayer interlayer technology for rapid transient-liquid-phase joining of advanced ceramics is demonstrated. Interlayers designed to exhibit rapid interdiffusion, chemical homogenization, and liquid film disappearance, enable rapid and reliable joining of ceramics at reduced temperatures while preserving high-temperature use capability. Processing times as short as 5 min at 1400 °C yield interlayers with a remelt temperature >2200 °C.

Ancillary