This material is based upon work supported by the National Science Foundation under grant DMI-0328162 and the U.S. Department of Energy, Division of Materials Sciences under Award No. DE-FG02- 07ER46471, through the Materials Research Laboratory and Center for Microanalysis of Materials (DE-FG02-07ER46453) at the University of Illinois at Urbana-Champaign.
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Research News
Stretchable Electronics: Materials Strategies and Devices†
Article first published online: 27 OCT 2008
DOI: 10.1002/adma.200801788
Copyright © 2008 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
Additional Information
How to Cite
Kim, D.-H. and Rogers, J. A. (2008), Stretchable Electronics: Materials Strategies and Devices. Adv. Mater., 20: 4887–4892. doi: 10.1002/adma.200801788
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Publication History
- Issue published online: 16 DEC 2008
- Article first published online: 27 OCT 2008
Funded by
- National Science Foundation. Grant Number: DMI-0328162
- U.S. Department of Energy
- Division of Materials Sciences. Grant Number: DE-FG02- 07ER46471
- Abstract
- References
- Cited By
Keywords:
- flexible electronics;
- integrated circuits;
- nanomaterials;
- nanomechanics
Abstract
New electronic materials have the potential to enable wearable computers, personal health monitors, wall-scale displays and other systems that are not easily achieved with established wafer based technologies. A traditional focus of this field is on the development of materials for circuits that can be formed on bendable substrates, such as sheets of plastic or steel foil. More recent efforts seek to achieve similar systems on fully elastic substrates for electronics that can be stretched, compressed, twisted and deformed in ways that are much more extreme than simple bending. This article highlights some recent progress in this area, with an emphasis on materials approaches and demonstrated devices.