Progress in the Field of Electrospinning for Tissue Engineering Applications

Authors

  • Seema Agarwal,

    Corresponding author
    1. Department of Chemistry and Scientific Center for Materials Science Philipps-Universität Marburg Hans Meerwein Strasse, 35032 Marburg (Germany)
    • Department of Chemistry and Scientific Center for Materials Science Philipps-Universität Marburg Hans Meerwein Strasse, 35032 Marburg (Germany).
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  • Joachim H. Wendorff,

    1. Department of Chemistry and Scientific Center for Materials Science Philipps-Universität Marburg Hans Meerwein Strasse, 35032 Marburg (Germany)
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  • Andreas Greiner

    Corresponding author
    1. Department of Chemistry and Scientific Center for Materials Science Philipps-Universität Marburg Hans Meerwein Strasse, 35032 Marburg (Germany)
    • Department of Chemistry and Scientific Center for Materials Science Philipps-Universität Marburg Hans Meerwein Strasse, 35032 Marburg (Germany).
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Abstract

Electrospinning is an extremely promising method for the preparation of tissue engineering (TE) scaffolds. This technique provides nonwovens resembling in their fibrillar structures those of the extracellular matrix (ECM), and offering large surface areas, ease of functionalization for various purposes, and controllable mechanical properties. The recent developments toward large-scale productions combined with the simplicity of the process render this technique very attractive. Progress concerning the use of electrospinning for TE applications has advanced impressively. Different groups have tackled the problem of electrospinning for TE applications from different angles. Nowadays, electrospinning of the majority of biodegradable and biocompatible polymers, either synthetic or natural, for TE applications is straightforward. Different issues, such as cell penetration, incorporation of growth and differentiating factors, toxicity of solvents used, productivity, functional gradient, etc. are main points of current considerations. The progress in the use of electrospinning for TE applications is highlighted in this article with focus on major problems encountered and on various solutions available until now.

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