Cover Picture

Cover Picture: Stop-Flow Lithography of Colloidal, Glass, and Silicon Microcomponents (Adv. Mater. 24/2008)

  1. Robert F. Shepherd1,
  2. Priyadarshi Panda2,
  3. Zhihao Bao3,
  4. Kenneth H. Sandhage3,
  5. T. Alan Hatton2,
  6. Jennifer A. Lewis1,*,
  7. Patrick S. Doyle1,*

Article first published online: 16 DEC 2008

DOI: 10.1002/adma.200890101

Issue

Advanced Materials

Advanced Materials

Volume 20, Issue 24, page n/a, December 17, 2008

Additional Information

How to Cite

Shepherd, R. F., Panda, P., Bao, Z., Sandhage, K. H., Hatton, T. A., Lewis, J. A. and Doyle, P. S. (2008), Cover Picture: Stop-Flow Lithography of Colloidal, Glass, and Silicon Microcomponents (Adv. Mater. 24/2008). Adv. Mater., 20: n/a. doi: 10.1002/adma.200890101

Author Information

  1. 1

    Department of Material Science and Engineering, University of Illinois, U-C 1304 W Green St., Urbana, IL 61801 (USA)

  2. 2

    Department of Chemical Engineering, Massachusetts Institute of Technology 77 Massachusetts Avenue, Cambridge, MA 02139 (USA)

  3. 3

    School of Material Science and Engineering, Georgia Institute of Technology 771 Ferst Drive, Atlanta, GA 30332 (USA)

*Department of Material Science and Engineering, University of Illinois, U-C 1304 W Green St., Urbana, IL 61801 (USA).

Publication History

  1. Issue published online: 16 DEC 2008
  2. Article first published online: 16 DEC 2008

SEARCH

SEARCH BY CITATION

ARTICLE TOOLS

Get PDF (439K)

Keywords:

  • ceramics;
  • colloids;
  • microelectromechanical systems;
  • microfluidics;
  • silicon
Thumbnail image of graphical abstract

A grand challenge in microfabrication is the creation of simple and complex 3D microcomponents of varying composition from colloidal building blocks. Jennifer Lewis, Patrick Doyle, and co-workers demonstrate on p. 4734 that colloidal, silicon, and glass microcomponents can be rapidly patterned by stop flow lithography (SFL). This work will enable fundamental studies of granular packing as well as provide a low-cost route to MEMS devices. Cover artwork by R. Shepherd, S. Eisenmann, and J. A. Lewis.

Get PDF (439K)