Ultrathin Silicon Circuits With Strain-Isolation Layers and Mesh Layouts for High-Performance Electronics on Fabric, Vinyl, Leather, and Paper

Authors

  • Dae-Hyeong Kim,

    1. Department of Materials Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA)
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  • Yun-Soung Kim,

    1. Department of Materials Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA)
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  • Jian Wu,

    1. Department of Civil and Environmental Engineering Northwestern University Evanston, IL 60208 (USA)
    2. Department of Mechanical Engineering Northwestern University Evanston, IL 60208 (USA)
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  • Zhuangjian Liu,

    1. Institute of High Performance Computing 1 Fusionopolis Way, #16-16 Connexis 138632 Singapore (Singapore)
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  • Jizhou Song,

    1. Department of Mechanical and Aerospace Engineering University of Miami Coral Gables, FL 33146 (USA)
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  • Hoon-Sik Kim,

    1. Department of Materials Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA)
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  • Yonggang Y. Huang,

    1. Department of Civil and Environmental Engineering Northwestern University Evanston, IL 60208 (USA)
    2. Department of Mechanical Engineering Northwestern University Evanston, IL 60208 (USA)
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  • Keh-Chih Hwang,

    1. FML, Departments of Engineering Mechanics Tsinghua University Beijing, 100084 (P. R. China)
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  • John A. Rogers

    Corresponding author
    1. Department of Materials Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA)
    2. Department of Chemistry Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA)
    3. Department of Mechanical Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA)
    4. Department of Electrical and Computer Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA)
    • Department of Materials Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois 61801 (USA).
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Abstract

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We present various stretchable high-performance CMOS circuit demonstrations on unconventional substrates, such as fabric, vinyl, leather, and paper. Electronics on such substrates, especially paper, open up new and important application possibilities for electronics. Theoretical analysis reveals the underlying mechanics of these systems; electrical tests under mechanical cycling demonstrate the robustness of the designs.

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