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Vacuum-Assisted Aerosol Deposition of a Low-Dielectric-Constant Periodic Mesoporous Organosilica Film

Authors

  • Wendong Wang,

    1. Materials Chemistry Research Group Chemistry Department, University of Toronto 80 St. George Street Toronto, Ontario, M5S 3H6 (Canada)
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  • Daniel Grozea,

    1. Department of Materials Science and Engineering University of Toronto 184 College Street Toronto, Ontario, M5S 3E4 (Canada)
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  • Ara Kim,

    1. Materials Chemistry Research Group Chemistry Department, University of Toronto 80 St. George Street Toronto, Ontario, M5S 3H6 (Canada)
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  • Douglas D. Perovic,

    1. Department of Materials Science and Engineering University of Toronto 184 College Street Toronto, Ontario, M5S 3E4 (Canada)
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  • Geoffrey A. Ozin

    Corresponding author
    1. Materials Chemistry Research Group Chemistry Department, University of Toronto 80 St. George Street Toronto, Ontario, M5S 3H6 (Canada)
    • Materials Chemistry Research Group Chemistry Department, University of Toronto 80 St. George Street Toronto, Ontario, M5S 3H6 (Canada).
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Abstract

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Low-dielectric-constant periodic mesoporous organosilica thin films are fabricated by vacuum-assisted aerosol deposition, a vapor-phase delivery technique favored by the semiconductor industry. The mesostructured films possess a combination of dielectric and mechanical properties that make them an ideal candidate for insulating materials on semiconductor chips (see image).

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