Solvent-Assisted Decal Transfer Lithography by Oxygen-Plasma Bonding and Anisotropic Swelling

Authors

  • Pilnam Kim,

    1. School of Mechanical and Aerospace Engineering World Class University Program on Multiscale Mechanical Design Seoul National University, Seoul 151-742 (Republic of Korea)
    2. Present address: Department of Mechanical and Aerospace Engineering, Princeton University, Princeton, NJ 08544 (USA)
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  • Rhokyun Kwak,

    1. School of Mechanical and Aerospace Engineering World Class University Program on Multiscale Mechanical Design Seoul National University, Seoul 151-742 (Republic of Korea)
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  • Sung Hoon Lee,

    1. School of Mechanical and Aerospace Engineering World Class University Program on Multiscale Mechanical Design Seoul National University, Seoul 151-742 (Republic of Korea)
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  • Kahp Y. Suh

    Corresponding author
    1. School of Mechanical and Aerospace Engineering World Class University Program on Multiscale Mechanical Design Seoul National University, Seoul 151-742 (Republic of Korea)
    • School of Mechanical and Aerospace Engineering World Class University Program on Multiscale Mechanical Design Seoul National University, Seoul 151-742 (Republic of Korea).
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Abstract

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Solvent-assisted decal transfer lithography (DTL) enables the formation of well-defined micro-/nanostructures over a large area (∼4 in. wafer) by combining irreversible oxygen bonding and anisotropic swelling of poly(dimethoxylsiloxane) (PDMS). Such swelling-induced stress gradient allows for cohesion failure of the skin layer upon removal of the stamp, leaving behind a highly uniform layer (∼100 nm).

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