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Curving Nanostructures Using Extrinsic Stress

Authors

  • Jeong-Hyun Cho,

    1. Department of Chemical and Biomolecular Engineering Johns Hopkins University Baltimore, MD 21218 (USA)
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  • Teena James,

    1. Department of Chemical and Biomolecular Engineering Johns Hopkins University Baltimore, MD 21218 (USA)
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  • David H. Gracias

    Corresponding author
    1. Department of Chemistry Johns Hopkins University Baltimore, MD 21218 (USA)
    2. Department of Chemical and Biomolecular Engineering Johns Hopkins University Baltimore, MD 21218 (USA)
    • Department of Chemistry Johns Hopkins University Baltimore, MD 21218 (USA).
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Abstract

We demonstrate the concept of inducing stresses in thin films post-deposition (extrinsic stress) to curve nanostructures on demand. The remarkably high extrinsic stress, induced by triggering grain coalescence in Sn thin films, was used to self]assemble 3D nanostructures with radii of curvature as small as 20 nm. The fabrication methodology required only simple processing steps and the self]assembly process was highly parallel. Curved nanostructures with any desired pattern and both homogeneous (rings, tubes) and variable radii of curvature (spirals, talons) could be constructed.

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