Advanced Materials

High-Density Stretchable Electronics: Toward an Integrated Multilayer Composite

Authors

  • Liang Guo,

    1. The Wallace H. Coulter Department of Biomedical Engineering, Georgia Institute of Technology and Emory University, 313 Ferst Drive NE, Atlanta, GA 30332–0535 (USA)
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  • Stephen P. DeWeerth

    Corresponding author
    1. The Wallace H. Coulter Department of Biomedical Engineering, Georgia Institute of Technology and Emory University, 313 Ferst Drive NE, Atlanta, GA 30332–0535 (USA)
    • The Wallace H. Coulter Department of Biomedical Engineering, Georgia Institute of Technology and Emory University, 313 Ferst Drive NE, Atlanta, GA 30332–0535 (USA).
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Abstract

High-density stretchable electronics are achieved using multilayer interconnects on an elastomeric substrate. Two major challenges associated with stretchable electronics—increasing integration density and improving electrical bonding—have been addressed by our innovative multilayer via-bonding technology. The resulting multichip-module architecture provides an elastic, high-density solution for numerous potential applications.

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