Ultrafast Transfer of Metal-Enhanced Carbon Nanotubes at Low Temperature for Large-Scale Electronics Assembly

Authors

  • Yifeng Fu,

    1. Department of Microtechnology and Nanoscience, Chalmers University of Technology, SE-412 96 Göteborg, (Sweden)
    2. FOAB Elektronik AB, S:t Jörgens väg 8, SE-422 49 Hisings Backa, (Sweden)
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  • Yiheng Qin,

    1. Department of Microtechnology and Nanoscience, Chalmers University of Technology, SE-412 96 Göteborg, (Sweden)
    2. SHT Smart High Tech AB, Fysikgränd 3, SE-412 96 Göteborg, (Sweden)
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  • Teng Wang,

    1. Department of Microtechnology and Nanoscience, Chalmers University of Technology, SE-412 96 Göteborg, (Sweden)
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  • Si Chen,

    1. Department of Microtechnology and Nanoscience, Chalmers University of Technology, SE-412 96 Göteborg, (Sweden)
    2. Key Laboratory of Advanced Display and System Applications and SMIT Center, School of Automation and Mechanical Engineering, Box 282, No. 149 Yan Chang Road, Yan Chang Campus, Shanghai University, Shanghai 200072, (P. R. China)
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  • Johan Liu

    Corresponding author
    1. Department of Microtechnology and Nanoscience, Chalmers University of Technology, SE-412 96 Göteborg, (Sweden)
    2. Key Laboratory of Advanced Display and System Applications and SMIT Center, School of Automation and Mechanical Engineering, Box 282, No. 149 Yan Chang Road, Yan Chang Campus, Shanghai University, Shanghai 200072, (P. R. China)
    • Department of Microtechnology and Nanoscience, Chalmers University of Technology, SE-412 96 Göteborg, (Sweden).
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Abstract

original image

An indium-assisted ultrafast carbon nanotube (CNT) transfer method with a yield rate over 90% is described. Metal-coated as-transferred CNT structures exhibit excellent electrical performance that is at least one order of magnitude better than the previously published results. Shear test results show that the adhesion between CNTs and the substrate is greatly improved and excellent flexibility is obtained after the transfer process.

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