Reduction of Lattice Thermal Conductivity in Single Bi-Te Core/Shell Nanowires with Rough Interface

Authors

  • Joohoon Kang,

    1. Department of Materials Science and Engineering, Yonsei University, 262 Seongsanno, Seodaemun-gu, Seoul 120–749, Republic of Korea
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  • Jong Wook Roh,

    1. Department of Materials Science and Engineering, Yonsei University, 262 Seongsanno, Seodaemun-gu, Seoul 120–749, Republic of Korea
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  • Wooyoung Shim,

    1. Department of Materials Science and Engineering, Yonsei University, 262 Seongsanno, Seodaemun-gu, Seoul 120–749, Republic of Korea
    Current affiliation:
    1. Department of Materials Science and Engineering, Northwestern University, 2145 Sheridan Road, Evanston, IL 60208 –3113, USA
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  • Jinhee Ham,

    1. Department of Materials Science and Engineering, Yonsei University, 262 Seongsanno, Seodaemun-gu, Seoul 120–749, Republic of Korea
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  • Jin-Seo Noh,

    1. Department of Materials Science and Engineering, Yonsei University, 262 Seongsanno, Seodaemun-gu, Seoul 120–749, Republic of Korea
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  • Wooyoung Lee

    Corresponding author
    1. Department of Materials Science and Engineering, Yonsei University, 262 Seongsanno, Seodaemun-gu, Seoul 120–749, Republic of Korea
    • Department of Materials Science and Engineering, Yonsei University, 262 Seongsanno, Seodaemun-gu, Seoul 120–749, Republic of Korea.
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Abstract

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The role of the interface roughness of Bi-Te core/shell nanowires is reported in reducing lattice thermal conductivity, which are prepared by on-film formation of nanowire (OFF-ON) that is capable of growing high-quality single-crystalline Bi nanowires, and by the subsequent sputtering of Te onto the Bi nanowires. The rough interface Bi-Te core/shell nanowires exhibit lower thermal conductivities than that of smooth interface counterparts, while electrical conductivities for these two types of nanowires are similar. We propose that the rough interface plays a pivotal role in suppressing phonon transport, which in turn, reduces thermal conductivity significantly.

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