High Seebeck Effects from Hybrid Metal/Polymer/Metal Thin-Film Devices

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Abstract

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The multi-layer metal/polymer/metal thin-film structure allows charge conduction but limits thermal conduction. The charge conduction is supported by Ohmic interfacial charge transfer and doped bulk transport. The thermal conduction is limited by polymer low thermal conductivity, acoustic mismatch, interfacial phonon scattering. As a result, the metal/polymer/metal thin-film devices can demonstrate significant Seebeck effect.

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