A Novel Solution-Stamping Process for Preparation of a Highly Conductive Aluminum Thin Film

Authors

  • Hye Moon Lee,

    Corresponding author
    1. Functional Materials Division, Korea Institute of Materials Science (KIMS), 797 Changwondaero, Seongsan-gu, Changwon, Gyeongnam, 641-831, Korea
    • Functional Materials Division, Korea Institute of Materials Science (KIMS), 797 Changwondaero, Seongsan-gu, Changwon, Gyeongnam, 641-831, Korea.
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  • Si-Young Choi,

    1. Materials Characterization and Measurement Group, Korea Institute of Materials Science (KIMS), 797 Changwondaero, Seongsan-gu, Changwon, Gyeongnam, 641-831, Korea
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  • Kyung Tae Kim,

    1. Functional Materials Division, Korea Institute of Materials Science (KIMS), 797 Changwondaero, Seongsan-gu, Changwon, Gyeongnam, 641-831, Korea
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  • Jung-Yeul Yun,

    1. Functional Materials Division, Korea Institute of Materials Science (KIMS), 797 Changwondaero, Seongsan-gu, Changwon, Gyeongnam, 641-831, Korea
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  • Dae Soo Jung,

    1. Department of Chemical and Biomolecular Engineering, Korea Advanced Institute of Science and Technology (KAIST), 192 Daehak-ro, Yuseong-gu, Daejeon, 305-701, Korea
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  • Seung Bin Park,

    1. Department of Chemical and Biomolecular Engineering, Korea Advanced Institute of Science and Technology (KAIST), 192 Daehak-ro, Yuseong-gu, Daejeon, 305-701, Korea
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  • Jongwook Park

    1. Department of Chemistry, Catholic University of Korea, 43 Jinbong-ro, Wonmi-gu, Bucheon, Gyeonggi, 420-743, Korea
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Abstract

original image

A novel solution-stamping process for the preparation of a highly conductive aluminum thin film on both rigid and flexible substrates is proposed. The superior electrical properties of Al thin films fabricated by the solution-stamping process compared to silver and gold films fabricated from colloidal nanoparticles are experimentally demonstrated, and their applications in electronic circuits on rigid and flexible substrates and to organic light-emitting diodes (OLEDs) are investigated.

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