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Interfacial Thermal Conductance of Transfer-Printed Metal Films

Authors

  • Dong-Wook Oh,

    1. Department of Materials Science and Engineering, Materials Research Laboratory, University of Illinois, Urbana, Illinois 61801, USA
    Current affiliation:
    1. D.-W.O. and S.K. contributed equally to this work.
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    • Department of Thermal Systems, Korea Institute of Machinery and Materials, Daejon 305-343, Korea

  • Seok Kim,

    1. Department of Materials Science and Engineering, Materials Research Laboratory, University of Illinois, Urbana, Illinois 61801, USA
    Current affiliation:
    1. D.-W.O. and S.K. contributed equally to this work.
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  • John A. Rogers,

    1. Department of Materials Science and Engineering, Materials Research Laboratory, University of Illinois, Urbana, Illinois 61801, USA
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  • David G. Cahill,

    Corresponding author
    1. Department of Materials Science and Engineering, Materials Research Laboratory, University of Illinois, Urbana, Illinois 61801, USA
    • Department of Materials Science and Engineering, Materials Research Laboratory, University of Illinois, Urbana, Illinois 61801, USA.
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  • Sanjiv Sinha

    1. Department of Mechanical Science and Engineering, University of Illinois, Urbana, Illinois 61801, USA
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Abstract

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The thermal conductance of transfer-printed interfaces is found to be surprisingly high, only a factor of 2–10 smaller than the thermal conductance of interfaces formed by physical vapor deposition. These results have practical importance for the thermal management of electronic devices assembled by transfer-printing and provide fundamental insights on the nature of solid-solid contacts between elastically stiff materials.

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