Coupling Electrodeposition with Layer-by-Layer Assembly to Address Proteins within Microfluidic Channels
Article first published online: 21 NOV 2011
Copyright © 2011 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
Volume 23, Issue 48, pages 5817–5821, December 22, 2011
How to Cite
Wang, Y., Liu, Y., Cheng, Y., Kim, E., Rubloff, G. W., Bentley, W. E. and Payne, G. F. (2011), Coupling Electrodeposition with Layer-by-Layer Assembly to Address Proteins within Microfluidic Channels. Adv. Mater., 23: 5817–5821. doi: 10.1002/adma.201103726
- Issue published online: 15 DEC 2011
- Article first published online: 21 NOV 2011
- Manuscript Received: 28 SEP 2011
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