On p. 2727, Heiko Jacobs and co-workers report on the liquid-liquid-solid self-tiling process where inorganic semiconductor dies follow a stepwise reduction in energy. The material is first preoriented at a liquid/liquid interface, then transferred in an epitaxy-like self-assembly process to a solderpatterned substrate to form close-packed domains. The inside cover shows a variety of differently shaped receptor domains and components with a large-area, 3D, tiled region in the background.
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