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Advanced Materials

A Self-healing Conductive Ink

Authors

  • Susan A. Odom,

    1. Department of Chemistry, Beckman Institute for Advanced Science & Technology, University of Illinois at Urbana-Champaign, 405 N. Mathews Ave. Urbana, IL 61801, USA
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  • Sarut Chayanupatkul,

    1. Department of Materials Science & Engineering, Beckman Institute for Advanced Science & Technology, University of Illinois at Urbana-Champaign, 405 N. Mathews Ave. Urbana, IL 61801, USA
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  • Benjamin J. Blaiszik,

    1. Department of Materials Science & Engineering, Beckman Institute for Advanced Science & Technology, University of Illinois at Urbana-Champaign, 405 N. Mathews Ave. Urbana, IL 61801, USA
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  • Ou Zhao,

    1. Department of Chemistry, Beckman Institute for Advanced Science & Technology, University of Illinois at Urbana-Champaign, 405 N. Mathews Ave. Urbana, IL 61801, USA
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  • Aaron C. Jackson,

    1. Department of Materials Science & Engineering, Beckman Institute for Advanced Science & Technology, University of Illinois at Urbana-Champaign, 405 N. Mathews Ave. Urbana, IL 61801, USA
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  • Paul V. Braun,

    1. Department of Materials Science & Engineering, Beckman Institute for Advanced Science & Technology, University of Illinois at Urbana-Champaign, 405 N. Mathews Ave. Urbana, IL 61801, USA
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  • Nancy R. Sottos,

    1. Department of Materials Science & Engineering, Beckman Institute for Advanced Science & Technology, University of Illinois at Urbana-Champaign, 405 N. Mathews Ave. Urbana, IL 61801, USA
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  • Scott R. White,

    Corresponding author
    1. Department of Aerospace Engineering, Beckman Institute for Advanced Science & Technology, University of Illinois at Urbana-Champaign, 405 N. Mathews Ave. Urbana, IL 61801, USA
    • Department of Aerospace Engineering, Beckman Institute for Advanced Science & Technology, University of Illinois at Urbana-Champaign, 405 N. Mathews Ave. Urbana, IL 61801, USA
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  • Jeffrey S. Moore

    Corresponding author
    1. Department of Chemistry, Beckman Institute for Advanced Science & Technology, University of Illinois at Urbana-Champaign, 405 N. Mathews Ave. Urbana, IL 61801, USA
    • Department of Chemistry, Beckman Institute for Advanced Science & Technology, University of Illinois at Urbana-Champaign, 405 N. Mathews Ave. Urbana, IL 61801, USA.
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Abstract

Electrical conductivity of mechanically damaged silver ink circuits is automatically restored using core–shell microcapsules. Upon mechanical damage to the circuit and microcapsules, silver particles reorganize by dissolution of the polymer binder layer upon release of solvent, hexyl acetate, from microcapsule cores. Conductivity is restored within minutes of damage, and no short-circuiting is revealed during the healing of closely spaced lines.

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