• Open Access

Dry Lithography of Large-Area, Thin-Film Organic Semiconductors Using Frozen CO2 Resists

Authors

  • Matthias E. Bahlke,

    Corresponding author
    1. Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA 02139, USA
    • Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
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  • Hiroshi A. Mendoza,

    1. Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA 02139, USA
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  • Daniel T. Ashall,

    1. School of Electronic Engineering, Bangor University, Dean Street, Bangor, LL57 1UT, UK
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  • Allen S. Yin,

    1. Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA 02139, USA
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  • Marc A. Baldo

    1. Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA 02139, USA
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Abstract

original image

To address the incompatibility of organic semiconductors with traditional photolithography, an inert, frozen CO2 resist is demonstrated that forms an in situ shadow mask. Contact with a room-temperature micro-featured stamp is used to pattern the resist. After thin film deposition, the remaining CO2 is sublimed to lift off unwanted material. Pixel densities of 325 pixels-per-inch are shown.

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